One Week News |TI establishes car material cache..........

At present, TI has begun to build buffer stock for auto components. According to data forecasts, more original equipment manufacturers will launch electric Car platform in 2025 and 2026, which will make it difficult to balance the supply at that time. In addition, some MPN supply cycles in TI's OPA series amplifiers have exceeded 110 weeks, and some customers have turned to seeking alternative models for this series; The planned orders for the TPS battery management series products have been postponed or not fully executed, due to the current backlog of orders being processed by manufacturers, which has delayed the disposal of the series products.

Starting from June, the delivery time of MICROCHIP products has gradually shortened. For example, the general materials have returned to within 30 weeks, while the delivery time of other materials is expected to only take 18 weeks. In addition, demand for MICROCHIP in July was mainly focused on EEPROM and MCU in the automotive industry, while general materials prices for these products were experiencing a downward trend due to high inventory of agents.

4. Onsemi and Magna International signed a long-term supply agreement

5. Extension of delivery time for ST products

The shortage of materials for ST is mainly concentrated in the 32-bit vehicle specification MCU SPC5 series, which limits the distribution of these products and is expected to extend the delivery time to 42-50 weeks. In addition, due to the increase in order cancellations by ST customers, the backlog of orders for STM32F4, STM32F7, and STM32H7 has been continuously delayed. For the most severely restricted series, the delivery time has been extended to 45-86 weeks.

6. ADI universal material delivery time returns to normal level
The overall demand for ADI in the third quarter was flat, with scarce materials mainly concentrated in the fields of industrial control, medical, and automotive regulations. However, there is sufficient supply of general materials in stock, and some part numbers have experienced market price inversion. The delivery time has also decreased to 13 weeks. In addition, this month ADI and Foxconn announced that they would establish a cooperation relationship in the field of vehicle use, jointly build a new generation of vehicle digital cockpit platform and efficient Battery management system, and have signed a memorandum of cooperation.

7. Vishay's MOSFETs may suffer shortages
On the Vishay side, due to the concentration of production capacity by the original factory to support the distribution of automotive series, 500V-650V MOSFETs may be affected, leading to shortages, especially in the SUM and SUP series products.

8. Micron Launches Industry's First HBM3 Gen2 Memory
This week, Micron launched the industry's first 8-layer 24GB HBM3 Gen2 memory chip, which features 1 β The process node is the next generation product of HBM3. Meguiar is the first manufacturer in the industry to produce second-generation HBM3 memory, and the performance of the HBM3 Gen2 per watt is about 2.5 times that of HBM3, significantly improving energy efficiency. Meiguang stated that the 24GB HBM3 Gen2 memory has been sampled to the customer.

9. Chip loss of $7 billion in the first half of the year, Samsung plans to continue reducing production
According to Reuters, Samsung Electronics stated on Thursday that the worst period in the global storage chip market has passed, but still announced plans to extend production cuts. This move highlights the unprecedented downturn in the semiconductor market, resulting in a record operating loss of 8.9 trillion won (approximately $7 billion) for the main chip business of the South Korean company in the first six months of this year.

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