News
Provide global integrated circuit, component and semiconductor industry news
Let you keep abreast of industrial development trends.
Tel： 86-755-82251239
Email： HCN@hcn-elec.com
Address： 1106, Shenhua Commercial Building, No. 2018, Jingbin Road, Jiabei Community, Nanhu Street, Luohu District, Shenzhen, Guangdong
2. Meiguang plans to increase the price of NAND wafers
After Samsung, Micron is also planning to reduce production of NAND Flash. According to channel providers, the price of NAND flash has increased and will also affect the pricing of NAND related products. In addition, Meguiar also stated that it is expected that the overall HBM market compound annual growth rate from 2022 to 2025 will exceed 50%. Meguiar is expected to have a 10% share of its overall unit shipments in HBM in the future, and the HBM3 Gen2 with a 1 beta production process will begin mass production and shipment next year, striving to compete for orders.
3. Most of NVIDIA's materials are increasing in price
In the trend of artificial intelligence driven by ChatGPT, GPU is particularly important for the entire AI model. The prices of NVIDIA's A100 and A800 have skyrocketed, with the A800 increasing by over 40%. The shortage and price increase of high-end cards have also driven the prices of mid range cards, such as A40 and A30, with significant increases compared to before. The price of RTX4090, currently the strongest consumer graphics card, is also continuously rising. In addition, the prices of graphics cards such as A5000 and A6000 have also doubled several times, and there is a shortage of stock.
4. Planned layoffs at a Volkswagen factory: hundreds of employees or affected
According to Deutsche Presse-Agentur, Volkswagen is considering cutting its factory employees in the eastern German city of Zwickau, which may affect hundreds of employees by the end of October, due to the sluggish demand for electric vehicles and the decline of subsidies from the German government for companies that purchase electric vehicles.
5. Huawei Xiaomi Strong Alliance! Reach a global patent cross licensing agreement
International Electronic Business News, 15th - Recently, Huawei announced on its official website that it and Xiaomi have reached a global patent cross licensing agreement, which covers communication technologies including 5G. This means that the future communication between these two Chinese mobile phone manufacturers will be closer, and it will also have a positive impact on the further expansion of the global patent pool of both sides.
6. Market value exceeds 60 billion US dollars! Arm was successfully launched and favored by multiple semiconductor manufacturers
On September 14th local time in the United States, Arm officially went public on NASDAQ, raising $4.87 billion, making it the largest IPO to date in 2023.
The current issuance code of Arm is "ARM", with an opening price of $56.10 per American depositary stock and an initial public offering price of $51. As of 4am Beijing time on September 15th, the closing price was $63.59, an increase of 24.68%, and the closing market value was $65.248 billion.
At present, the global semiconductor industry is facing a downward cycle of cold winds, which coincides with the generative artificial intelligence ChatGPT causing a global wave of AI and giving rise to a huge demand for AI functionality. Data shows that Arm can provide CPU, GPU, system IP, computing platform products, as well as development tools and software that support product development and deployment, meeting the requirements of AI technology architecture.
According to the publicly available Arm IPO documents, basic investors such as AMD, Apple, Cadence, Google, Intel, and affiliated entities of MediaTek, NVIDIA, Samsung Electronics, Xinsi Technology, and TSMC have expressed interest in purchasing Arm's total stock of 735 million US dollars.
The industry believes that during the period of global semiconductor industry recovery, Arm's successful listing will also inspire other startups to rush to the IPO market.
7. Samsung promotes FO-PLP 2.5D advanced packaging technology to catch up with TSMC
Korean media pointed out that Samsung will launch FO-PLP's 2.5D advanced packaging technology to attract customers in order to catch up with TSMC's advanced packaging artificial intelligence (AI) chips.
South Korean media Etnews reported that the Advanced Packaging (AVP) team of Samsung's DS department has started developing FO-PLP advanced packaging for 2.5D chip packaging, which can integrate SoC and HBM into silicon intermediate layers to form a complete chip.
2.5D packaging is an indispensable manufacturing process for artificial intelligence chips in recent years. For NVIDIA artificial intelligence chips, which are in short supply globally, the integration of 2.5D packaging technology was adopted, but the order was won by TSMC's CoWoS 2.5D advanced packaging.
Unlike TSMC CoWoS 2.5D, Samsung FO-PLP 2.5D is packaged on a square substrate, while TSMC CoWoS 2.5D is a circular substrate. Samsung FO-PLP 2.5D does not have edge substrate loss issues and has high productivity. However, due to the need to transplant chips from wafers to square substrates, the operating procedure is more complex.
The report quotes South Korean market insiders as saying that from the continuous publication of FO-PLP papers by Samsung at international academic conferences, Samsung is committed to developing FO-PLP to overcome the limitations of 2.5D packaging. If FO-PLP is successful, it can compete with wafer foundry and memory businesses. Therefore, Samsung proposes a one-stop solution (Turn key) to attract customers, producing semiconductors for AI design manufacturers such as NVIDIA and AMD, along with HBM and advanced packaging. If advanced packaging is more competitive, Samsung can further expand its semiconductor business.
(Disclaimer: The above content is compiled from online information and does not represent HCN's views or positions. It is only for communication and learning purposes. If there is any infringement, please contact to delete it)